Model Number: optical alignment BGA reworkstation
Brand Name: WDS-650 BGA rework station
Key Specifications/Special Features:
WDS-650 optical alignment BGA rework station with 3 years warrantyOur advantages:1. Auto solder and desolder the BGA chips, no need to use joystick - easy to operate2. High precision optical alignment system - rework success rate 99%3. High definition industrial camera + laser position + 15-inch LCD monitor (we can add a side camera to view the chips melting process, just as per your request) - flexible to adjust the machine design4. Heating zone (IR area) is good for laptop, mobile phone, PS3 Xbox360, PCB board, doesn't damaged the board - wide application
WDS-650 mobile phone IC replacement machine1. Upper heating head and placement head are design 2-in-1, which have automatic welding and automatic placement function
2. WDS-650 uses the touchscreen, HMI, PLC control, which can show you the three temperature curves anytime and the temperature control can accurate to 1°C8 paragraph temperature controls, which can be set to warm up, insulation, heating, soldering 1, soldering 2, cooling
Excellent temperature control system can ensure the best soldering effect.
3. Have 3 temperature zones to heating independent, the first and second temperature zones can control many groups and paragraphs temperatures at the same time, the third temperature zone can preheating a large areas of the PCB board, and make the best soldering effect.
4. Second zone designs specially to supports PCB board, which can go up and down, prevent the PCB board collapse from the damage during soldering
5. Select high precision K-type thermocouple closed loop control, temperature measurement interface in outside can achieve precise temperature detection
6. Store more than 100 temperature cure setting, change setting and analysis the curve at anytime
7. Using the V-shaped groove to position the PCB board, removable universal jigs can protect the PCB board
8. Using high power cross-flow fan to cooling PCB board in a short time, protect the PCB board and ensure the soldering effect
9. With alarm function, after the BGA welding the machine can alarm by itself
In case of temperature abuse, circuit can power off automatically with the double over-temperature protection
10. Touchscreen control of upper heating system and optical digital device, easy to operate and ensure alignment precision control within 0.01-0.02mm
11. Using high precision optical alignment video system with spectral amplification, fine-tuning function, with 15" color LCD monitor
High automatic, can avoid the human operating errors and have excellent special effect on lead-free technology as well as the pop packing devices
* Training and warranty:Lifetime free training of operation and maintenance
Warranty: lifetime free service, one year warranty
Total power |
5100W |
Upper heating power |
1200W |
Lower heating power |
Second temperature zone 1200W, third temperature zone 2700W |
Power supply |
(Single phase) 110/220V AC ±10 50Hz ±3, 5.2kVA |
Overall dimensions |
(L) 880 x (W) 880 x (H) 720mm (not includes display holder) |
Locating way |
V-shaped groove, PCB holder can adjust any direction of X, Y |
Temperature controlling |
(high precision K-sensor)(closed loop), UP and down can test temperature independently |
Large PCB size |
450 x 430mm |
Small PCB size |
10 x 10mm |
Chip zoom multiple |
2-50multiple |
Weight of machine |
85kg |